Wangling F4BTMS233 DK2.33 Df0.0010 (0.09mm-) Copper Clad Laminate
Brief Introduction
F4BTMS233 is an upgraded material in the F4BTMS series, representing a technological breakthrough in formulation and manufacturing. It incorporates a significant amount of ceramic filler and is reinforced with ultra-thin, superfine fiberglass cloth. This aerospace-grade, high-reliability material offers superior performance with a broader dielectric constant range and can serve as a domestic replacement for similar international products.
Technical Features & Benefits
Small dielectric constant tolerance with excellent batch-to-batch consistency.
Ultra-low dielectric loss.
Stable dielectric constant and low loss values up to 40 GHz, suitable for phase-sensitive applications.
Excellent temperature coefficients for Dk and Df, maintaining stable frequency and phase performance from -55°C to 150°C.
Superior radiation resistance, retaining stable electrical and physical properties after irradiation.
Low outgassing performance, meeting aerospace vacuum outgassing requirements.
Low CTE in X, Y, and Z directions, ensuring dimensional thermal stability and hole copper reliability.
Improved thermal conductivity for higher power applications.
Excellent dimensional stability.
Low water absorption.
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Typical Properties: F4BTMS 233
| Property |
Test Condition |
Unit |
F4BTMS233 |
| Dielectric Constant (Typ.) | 10GHz | – | 2.33 |
| Dielectric Constant Tolerance | – | – | ±0.03 |
| Dielectric Constant (Design) | 10GHz | – | 2.33 |
| Dissipation Factor (Typ.) | 10GHz | – | 0.0010 |
| 20GHz | – | 0.0011 |
| 40GHz | – | 0.0015 |
| Dielectric Constant Temp. Coeff. | -55℃～150℃ | ppm/℃ | -122 |
| Peel Strength | 1 OZ RTF Foil | N/mm | >2.4 |
| Volume Resistivity | Normal | MΩ·cm | ≥1×10⁸ |
| Surface Resistance | Normal | MΩ | ≥1×10⁸ |
| Electric Strength (Z) | 5KW, 500V/s | KV/mm | >30 |
| Breakdown Voltage (XY) | 5KW, 500V/s | KV | >38 |
| CTE (X, Y) | -55℃～288℃ | ppm/℃ | 35~40 |
| CTE (Z) | -55℃～288℃ | ppm/℃ | 220 |
| Thermal Stress | 260℃, 10s, 3 cycles | – | No delamination |
| Water Absorption | 20±2℃, 24h | % | 0.02 |
| Density | Room Temperature | g/cm³ | 2.22 |
| Long-term Operating Temp. | – | ℃ | -55～+260 |
| Thermal Conductivity (Z) | Z-direction | W/(m·K) | 0.28 |
| Flammability | – | UL-94 | V-0 |
| Material Composition | – | – | PTFE, Ultra-thin Superfine (Quartz) Fiberglass, Ceramic |
Application Areas
Aerospace and aviation equipment, space and cabin systems.
Microwave and RF applications.
Radar and military radar systems.
Feed networks.
Phase-sensitive antennas, phased array antennas.
Satellite communication.
Available Configurations:
Standard Panel Sizes (Custom sizes available upon request):
305×460mm | 460×610mm | 610×920mm
Standard Copper Foil:
Type: Standard RTF low-profile copper foil.
Available Thickness: 0.5OZ (0.018mm), 1OZ (0.035mm).
Options: Can be paired with 50Ω embedded resistive foil, aluminum base, or copper base.
Thickness Availability:
F4BTMS233 can be supplied with a minimum core thickness of 0.09mm.
Available in multiples of 0.09mm or 0.127mm.
Metal Clad Variants (F4BTMS233-AL/CU):
This model is available as metal-clad laminates with aluminum or copper bases for enhanced shielding or heat dissipation.
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